Umahluko :
I-1, i-laser wavelength yomatshini wokumakisha we-fiber laser yi-1064nm. Umatshini wokumakisha we-laser we-UV usebenzisa i-laser ye-UV ene-wavelength ye-355nm.
2, Umgaqo wokusebenza uhlukile
Oomatshini bokuphawula iFayibha laser basebenzisa imiqadi yelaser ukwenza amanqaku asisigxina kumphezulu wezinto ezahlukeneyo. Umsebenzi wokumakisha kukuveza izinto ezinzulu ngokuphuphuma kwesixhobo somphezulu, okanye "ukukrola" umkhondo ngotshintsho olubonakalayo lwesixhobo esingaphezulu esibangelwa amandla okukhanya, okanye ukubonisa ipateni, isicatshulwa, kunye nebhakhowudi ukuba ifakwe ngokutshisa inxalenye yezinto ngokusebenzisa amandla okukhanya kunye nezinye iintlobo zegraphic.
Umatshini wokumakisha we-laser we-Ultraviolet luluhlu lweematshini zokumakisha ze-laser, ngoko ke umgaqo ufana nowomatshini wokumakisha we-laser, esebenzisa imiqadi ye-laser ukwenza amanqaku asisigxina kumphezulu wezinto ezahlukeneyo. Umsebenzi wokumakisha kukwaphula ngokuthe ngqo ikhonkco lemolekyuli yezinto ngokusebenzisa i-laser-wave short-wave (eyahlukileyo kwi-evaporation yezinto ezingaphezulu eziveliswe yi-laser-long-wave ukuveza izinto ezinzulu), ukutyhila ipateni kunye nombhalo oza kuqhutyelwa phambili.
4. Iinkalo ezahlukeneyo zesicelo
Umatshini wokumakisha weFiber laser ngokusisiseko ulungele ukuphawulwa kwelaser kwiindawo ezahlukeneyo zetsimbi. Ngenxa yobushushu obuveliswa ngumqadi wayo, ayifanelekanga ukumakishwa okuchanekileyo okuphezulu kwezinto ezikhethekileyo. thanda:
Isetyenziswe ngokubanzi kwiitshiphu zesekethe ezidibeneyo, izixhobo zekhompyuter, iibheringi zoshishino, iiwotshi, iimveliso zonxibelelwano lwe-elektroniki, izixhobo ze-aerospace, iinxalenye zemoto ezahlukeneyo, izixhobo zasekhaya, izixhobo ze-hardware, i-molds, iingcingo kunye neentambo, ukupakishwa kokutya, ubucwebe, icuba, umkhosi, njl.
Umatshini wokumakisha we-laser we-Ultraviolet: ufanelekile ngokukodwa kwimarike ephezulu yokulungiswa kakuhle. thanda:
A. Izithambiso, amayeza, izixhobo kunye nezinye iibhotile zokupakisha izinto ze-polymer zineempembelelo ezintle zokumakisha umphezulu, amandla okucoca anamandla, angcono kunekhowudi ye-inkjet, kwaye akukho ngcoliseko;
B. Ukumakishwa kunye scribing iibhodi pcb bhetyebhetye; ukusetyenzwa kwemingxuma emincinci kunye nemingxuma eyimfama kwi-silicon wafers;
C. LCD liquid crystal glass two-dimensional code marking, glass surface drilling, metal surface coating marking, amaqhosha eplastiki, amacandelo e-elektroniki, izipho, izixhobo zokunxibelelana, izinto zokwakha, njl.
Ixesha lokuposa: Feb-20-2023
