Ukuchaneka kwe-Laser yokusika kudla ngokuchaphazela umgangatho wenkqubo yokusika. Ukuba ukuchaneka komatshini wokusika i-laser kuyaphambuka, umgangatho womkhiqizo osikiweyo uya kuba ungafanelekile. Ngoko ke, indlela yokuphucula ukuchaneka komatshini wokusika i-laser ngumba ophambili weengcali zokusika i-laser.
1. Yintoni ukusika i-laser?
Ukusika i-Laser yitekhnoloji esebenzisa i-laser ye-high-power density beam njengomthombo wobushushu kwaye yenza ukusika ngentshukumo ehambelanayo kunye ne-workpiece. Umgaqo wayo osisiseko ngulo: i-laser ye-high-power density beam ikhutshwa yilaser, kwaye emva kokuba igxininiswe yinkqubo ye-optical path, ifakwe kwi-irradiated ukuya kumphezulu we-workpiece, ukwenzela ukuba ubushushu be-workpiece buphakanyiswe ngokukhawuleza. ubushushu obuphezulu kunendawo yokunyibilika ebalulekileyo okanye indawo yokubila. Kwangaxeshanye, phantsi kwesenzo soxinzelelo lwemitha yelaser, uluhlu oluthile lwerhasi yoxinzelelo oluphezulu lwenziwa malunga nendawo yokusebenza ukuvuthela isinyithi esinyibilikisiweyo okanye esinomphunga, kwaye ukusika i-pulse kunokukhutshwa ngokuqhubekayo ngexesha elithile. Njengoko indawo ehambelanayo ye-boam kunye ne-workpiece ihamba, i-slit ekugqibeleni yenziwe ukufezekisa injongo yokusika.
Ukusika i-Laser akukho burrs, imibimbi, kunye nokuchaneka okuphezulu, okungcono kunokusika i-plasma. Kumashishini amaninzi okwenziwa kwe-electromechanical, iinkqubo zokusika i-laser zanamhlanje ezineenkqubo ze-microcomputer zinokusika ngokulula izinto zokusebenza zeemilo ezahlukeneyo kunye nobukhulu, ngoko zihlala zikhethwa ngaphezu kweenkqubo zokubethelwa kunye nokufa. Nangona isantya sayo sokucubungula sicotha kunokubetha i-die punching, ayidli iimbumba, ayifuni ukulungisa iimbumba, kwaye igcina ixesha lokutshintsha i-molds, ngaloo ndlela igcina iindleko zokusebenza kunye nokunciphisa iindleko zemveliso. Ngoko ke, kunoqoqosho ngokubanzi.
2. Izinto ezichaphazela ukuchaneka kokusika
(1) Ubungakanani bendawo
Ngethuba lenkqubo yokusika umatshini wokusika i-laser, i-beam yokukhanya igxininise kakhulu kwi-lens yentloko yokusika, ukwenzela ukuba ugxininiso lufikelele kumandla aphezulu. Emva kokuba i-laser beam igxininiswe, indawo yenziwa: indawo encinci emva kokuba i-laser beam igxininisekile, iphezulu ukuchaneka kwe-laser cutting processing.
(2) Ukuchaneka kwe-workbench
Ukuchaneka kwebhentshi yokusebenzela ngokuqhelekileyo kumisela ukuphindaphindwa kwenkqubo yokusika i-laser. Iphezulu yokuchaneka kwebhentshi yomsebenzi, iphezulu ukuchaneka kokusika.
(3) Ubungqingqwa bomsebenzi
Ubuninzi bomsebenzi oza kucutshungulwa, isezantsi ukuchaneka kokusikwa kwaye inkulu i-slit. Ekubeni i-laser beam i-conical, i-slit nayo i-conical. I-slit ye-thinner material incinci kakhulu kuneyona nto inzima.
(4) Isixhobo sokusebenza
Izinto zokusebenza zinempembelelo ethile ekuchanekeni kwe-laser cutting. Ngaphantsi kweemeko ezifanayo zokusika, ukuchaneka kokusika kwezinto zokusebenza zezinto ezahlukeneyo zihluke kancinci. Ukuchaneka kokusika kwamacwecwe ensimbi kuphezulu kakhulu kunezinto zobhedu, kwaye indawo yokusika ilula.
3. Iteknoloji yokulawula indawo ekugxilwe kuyo
Okukhona ubuncinci ubunzulu bengqwalasela yelensi, kokukhona buncinci idayamitha yendawo ekugxilwe kuyo. Ngoko ke, kubaluleke kakhulu ukulawula isikhundla sokugxila ngokubhekiselele kumphezulu wezinto ezisikiweyo, ezinokuphucula ukuchaneka kokusika.
4. Iteknoloji yokusika kunye nokubhoboza
Nayiphi na iteknoloji yokusika i-thermal, ngaphandle kweemeko ezimbalwa apho inokuqala ukusuka kumda weplate, ngokubanzi idinga umngxuma omncinci wokubethelwa kwi-plate. Ngaphambili, kumatshini we-laser stamping composite, i-punch yayisetyenziselwa ukubetha umngxuma kuqala, kwaye emva koko i-laser isetyenziswe ukuqala ukusika ukusuka kumngxuma omncinci.
5. Uyilo lweNozzle kunye neteknoloji yokulawula ukuhamba komoya
Xa intsimbi yokusika i-laser, ioksijini kunye ne-laser beam egxininisiweyo idutyulwa kwizinto ezisikiweyo ngombhobho, ngaloo ndlela zenza umqadi wokuhamba komoya. Iimfuno ezisisiseko zokuhamba komoya kukuba ukuhamba komoya okungena kwi-incision kufuneka kube kukhulu kwaye isantya kufuneka sibe phezulu, ukwenzela ukuba i-oxidation eyaneleyo ikwazi ukusabela ngokupheleleyo kwi-exothermic ye-incision material; ngexesha elifanayo, kukho ukukhawuleza okwaneleyo ukukhupha izinto ezityhidiweyo.
Ixesha lokuposa: Aug-09-2024
